Ioannis (John) Kymissis’s research focuses on the application of thin film materials in the development of new electronic and optical systems. Thin film systems are built by depositing active materials such as semiconductors, piezoelectrics, and optical materials onto substrates to add new functionalities such as light emission, switching, sensing, and amplification. The technology and techniques used for this processing allows for the co-integration of a variety of functionalities in combinations that allow for the development of a broad range of new devices and systems. These systems have application to displays, energy storage and conversion, mechanical and chemical sensors, and communication, unlocking new technologies that can be applied to healthcare, environmental sensing, security applications, and energy harvesting.
- Postdoctoral fellow, MIT, 2003-2006
- Senior Engineer, QD Vision, 2005-2006
- Associate professor of chemical engineering, Columbia University, 2011-present
- Assistant professor of Electrical Engineering, Columbia University, 2006–2011
- IEEE
- Society for Information Display (SID)
- SPIE
- Materials Research Society (MRS)
- Architizer A+ Award
- Verizon Powerful Answers
- Popular Science, Invention of the Year
- Interdigital Innovation Challenge
- MIT/USDOE Clean Energy Prize
- Ocean Optics Blue Ocean Award
- Kim Award for Undergraduate Involvement
- Vodaphone Americas Foundation Wireless Innovation Award
- NSF CAREER award
- IVMC Shoulders Gray Spindt award
- IEEE EDS Paul Rappaport Award
- “Color Fine Tuning of Optical Materials Through Rational Design” Brigitte Holzer, Johannes Bintinger, Daniel Lumpi, Christopher Choi, Youngwan Kim, Berthold Stoger, Christian Hametner, Martina Marchetti-Deschmann, Felix Plasser, Ernst Horkel, Ioannis Kymissis, Johannes Fröhlich. ChemPhysChem (ASAP)
- “An Intracochlear Pressure Sensor as a Microphone for a Fully Implantable Cochlear Implant” Francis Pete X Creighton, Xiying Guan, Steve Park, Ioannis John Kymissis, Hideko Heidi Nakajima, Elizabeth S Olson. Otology and Neurotology 37(10) 1596-1600
- “Length-Independent Charge Transport in Chimeric Molecular Wires” Austin G Wardrip, Amir Mazaheripour, Nina Hüsken, Jonah?Micah Jocson, Andrew Bartlett, Robert C Lopez, Nathan Frey, Cade B Markegard, Gregor Kladnik, Albano Cossaro, Luca Floreano, Alberto Verdini, Anthony M Burke, Mary N Dickson, Ioannis Kymissis, Dean Cvetko, Alberto Morgante, Sahar Sharifzadeh, Hung D Nguyen, Alon A Gorodetsky. Angewandte Chemie International Edition 55(46) 14267-14271
- “Improving the radiation hardness of graphene field effect transistors” Konstantinos Alexandrou, Amrita Masurkar, Hassan Edrees, James F Wishart, Yufeng Hao, Nicholas Petrone, James Hone, Ioannis Kymissis. . Applied Physics Letters 109(15) 153108.
- “A macroscopic model for vertical graphene-organic semiconductor heterojunction field-effect transistors” CH Kim, H Hlaing, I Kymissis Organic Electronics 36, 45-49
- “Microscopy and micro-Raman study of periodically poled domains in deeply thinned lithium niobate wafers” PS Bullen, HC Huang, H Yang, JI Dadap, I Kymissis, RM Osgood. Optical Materials 57, 243-248
- “Effect of vacuum thermal annealing to encapsulated graphene field effect transistors” Konstantinos Alexandrou, Filippos Farmakis, Alexandros Arapis, Nikolaos Georgoulas, Yufeng Hao, James Hone, Ioannis Kymissis. Journal of Vacuum Science \& Technology B 34 (4), 041805
- “Metacapacitors: Printed Thin Film, Flexible Capacitors for Power Conversion Applications.” Barry Van Tassell, et al. Power Electronics, IEEE Transactions on. 2016 Apr;31(4):2695-708.
- “Energy-Harvesting Active Networked Tags (EnHANTs): Prototyping and Experimentation.” Margolies R, Gorlatova M, Sarik J, Stanje G, Zhu J, Miller P, Szczodrak M, Vigraham B, Carloni L, Kinget P, Kymissis I. ACM Transactions on Sensor Networks (TOSN). 2015 Nov 2;11(4):62.
- “Sequential Lateral Solidification of Silicon Thin Films on Cu BEOL-Integrated Wafers for Monolithic 3-D Integration.” Carta F, Gates SM, Limanov AB, Im JS, Edelstein DC, Kymissis I. Electron Devices, IEEE Transactions on. 2015 Nov;62(11):3887-91.